FOG ( LCD / OLED)
Features
- Fine pitch interconnection : 50㎛ pitch for TFT-LCD, color STN, EL,
- High adhesion, high reliability, void-free bonding, and repairable by common solvents.
- Applicable for fine pitch OLB with shorter bonding times.
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| FOG-1 |  |
Ni/Au-polymer | 10 ㎛ | 800 pcs/mm2 | 50,000 ㎛2 | 50 ㎛ | 180~200 ℃ | 8 sec | 2~4 MPa |  |
| FOG-2 |  |
Ni-polymer | 5 ㎛ | 6,000 pcs/mm2 | 13,000 ㎛2 | 12 ㎛ | 140~180 ℃ | 5 sec | 2~4 MPa | |
| FOG-3 |  |
Ni-polymer | 4 ㎛ | 6,000 pcs/mm2 | 13,000 ㎛2 | 12 ㎛ | 140~180 ℃ | 5 sec | 2~4 MPa | |