Camera Module
Features
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| CM-1 |  |
Ni/Au-polymer | 20 ㎛ | 350 pcs/mm2 | 90,000 ㎛2 | 80 ㎛ | 120~180 ℃ | 6 sec | 0.2~0.3 MPa |  |
| CM-2 |  |
Ni/Au-polymer | 10 ㎛ | 1,200 pcs/mm2 | 50,000 ㎛2 | 75 ㎛ | 180~200 ℃ | 7 sec | 1~3 MPa | |