Fingerprint
Features
| ITEM | Conductive Particle | Pitch Size | Main bonding Condition | TDS | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Series | Image | Type | Size | Density | Line | Space | Temp | Time | Pressure | File |
| FPM-1 |  |
Ni/Polymer | 8.0 ㎛ | 820 pcs/mm2 | 25,000 ㎛2 | 20 ㎛ | 140~ 160 ℃ | 5 sec | 2~4 MPa |  |
| FPM-2 |  |
Au/Ni/Polymer | 30.0 ㎛ | 200 pcs/mm2 | 80,000 ㎛2 | 150 ㎛ | 130~190 ℃ | 4 sec | 1~3 MPa | |